2 Layer PCB
2 Layer PCB Capabilities
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MULTILAYER LAMINATION
Maximum Board Size: 30"X42"
Maximum number of layers: 24
Maximum board thickness: .200"
Panel Thickness tolerances
Panel Thickness
Tolerances
.015"-.030"
+/- 10%
>.031"
+/- 10%
MATERIALS
Laminate per IPC-4101 with the follownig parameters:
Material types used
Name
Max Tg (C)
FR404
140
FR-406
160
FR-408
180
Getek ML200/Nelco N4000-13
>180
Polyimide
235
Arlon 85N
250
Rogers 4003
Inner layer copper cladding
Maximum cu weight (planes)
3 oz
Maximum cu weight (signals)
3 oz
Minimum cu weight
1/2 oz
Outer layer copper cladding
Maximum cu weight
4 oz
Minimum cu weight
1/8 oz
Etching
Cupric Chloride Etching (inner)
Ammonia Etching (outer)
Minimum conductor width: .002"
Minimum feature spacing: .003"
Finished conductor widths from the original artwork
Cu weight
Internal
External
1 oz and below
+.001"
+.001"
2 oz
+/-.002"
+/-.002"
Drilling
Buried & Blind Vias
Minimum drilled hole size: .008" (Finished .004")
Minimum slot width size: .029" (Finished .025")
Minimum hole size tolerances
Hole size
Unplated
Plated
< .040"
+/- .001"
+/- .002"
.040"-.093"
+/- 0015"
+/- .003"
.094"-.257"
+/- 002"
+/- .004"
Minimum distance, edge to edge, from plated hole to internal circuitry or plane: .010"
Minimum distance, edge to edge, from non-plated hole to circuitry: .010" internal/.007" external
Standard finished minimum annular ring if not specified otherwise: .001"
Desired Minimum pad size is .014" over hole dia.
Tighter annular ring is possible with teardrops or by reducing finished annular ring requirements.
Controlled depth drill available
Plating
Maximum Hole Aspect Ratio: 12:1
(SMOBC) Soldermask over bare copper, HASL/Immersion Tin
SMOBC with OSP, ENTEK Coating 106a
Immersion Gold, Selective or Full Body
Electroless Gold, Selective or Full Body
Electrolytic Gold, Selective or Full Body
Soft Bondable Gold, Selective or Full Body
Layer Constructions/Impedance Design
Minimum core thickness: .004"
Minimum dielectric: .0035" (2113)
Impedance stack-up design and verification service
Buried and blind vias
Sequential lamination structure
Differential Impedance
Fabrication
Tolerance on overall dimensions: +/- .005"
Minimum inside radius: .015"
Scoring, In-board Beveling, Beveling
Countersinking, Counter-boring, Edge Milling
Soldermask/ Legend
Per IPC-SM-840
Wet types: SR1000, SR1020, SR2030
LPI
Dry Film types: Dupont Vacrel, 8000 series
Soldermask colors: Red, Green, Blue, Black, Clear
Minimum clearance: LPI-.002", Dry Film -.003", Wet Mask -.006"
Legend colors: White, Yellow, Black, Red, Orange
Electrical Test
CAD net-list testing (IPC356D)
Electical test parameters compliant with IPC and Bellcore specifications
Probe testing down to 0.006"
Standard test parameters: isolation - 10 meg ohms, continuity - 10 ohms
Voltage up to 250 Volts
Impedance Measurements
Printouts of Impedance measurements
Impedance measurements of specific traces
Single ended and differential impedances
Laboratory
Standard and thermal stress cross-section evaluation (IPC-RB276)
Layer construction verification
Fully equipped chemical analysis lab
Certifications / Quality Systems/ SPC
ISO 9002 (PENDING AUDIT)
Integrated IPQC (In Process Quality Control) and OQC (Outgoing Quality Control) systems
IPC-A-600 trained personnel
Control charts on critical processess
Delivery
Quick Turn Delivery is as fast as 12 hours
Standard Delivery is in 5 - 8 days
Turn time is based on business days counted in 24 hour cycles
WEEKENDS AVAILABLE FOR SPECIAL REQUIREMENTS